Jiangsu, China
Business Type:
Trading Company
Business Range:
Electrical & Electronics
OEM/ODM Service
Sample Available
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Solder, Welding Material, Paste manufacturer / supplier in China, offering Tin Lead No Clean Solder Paste Sn63pb37, SGS/Ce Snbi58 Solid Core Alloy Wire Solder Wire Welding Wire, Tool Steel & High-Speed Steel Metal Powder and so on.

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Tin Lead No Clean Solder Paste Sn63pb37

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Min. Order / Reference FOB Price
100 KG US $23.5-26.5/ KG
Port: Shanghai, China
Production Capacity: 100tons Per Month
Payment Terms: T/T
Viscosity (PA.S): 190±20
Melting Point: 183 ºC
Storage Temperature: 2-10 ºC
Transport Package: Carton Box
Specification: P-LH20011(Sn63Pb37)
Trademark: LIHNG

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Basic Info

Model NO.: Sn63Pb37
Origin: China

Product Description

Tin Lead No Clean Solder Paste Sn63pb37

1.  Introduction of product

P-LH20011 solder paste is medium active rosin based cleaning free tin lead solder paste. The residue after welding is little and not easy to decompose. It is satisfied to the requirements of cleaning free. It has a wide range of optional process parameters, and can ensure excellent continuous printing, collapse resistance, surface insulation resistance.

2  Property of product
2.1  Alloy ingredient
 
 
SnPbAgCuSbBiZnFeCdAlAs
63±0.5Balance0.0150.030.050.030.0010.020.0010.0010.015
 
2.2 Property of solder paste
 
ItemCharacteristicsTesting method
Flux content wt%10.0±0.3JIS Z 3197(1999)-8.1.2
Halide content in flux wt%0.04±0.02JIS Z 3197(1999)-8.1.4.2.1
Viscosity  (Pa.s)190±20IPC-TM-650-2.4.34
Malcom PCU205  10rpm
Insulation resistance40ºC 90%>1×1012JIS Z 3284-3
Copper MirrorClass LIPC-TM-650-2.3.32
Corrosion of residueNo corrosionJIS Z 3284-4
Print abilityM3JIS Z3284-5
Slump in printing
0.2mmJIS Z 3284-7
Slump in heating0.2mmJIS Z 3284-8
Tackiness24hrsJIS Z 3284-9
Wetting and dewettingClass 2JIS Z 3284-10
Solder ball testClass 1~2JIS Z 3284-11
Tackiness of residueNo tackinessJIS Z 3284-12
MigrationNo occurJIS Z 3284-14
Solder powder shape and particle size  (μm)A45~25  sphericalMicroscopic measurement
B38~20  spherical
Melting point  (ºC)183DSC

 
3 Weight and Package
Package
TypeN/W
Plastic container(inner package)500g
Foam box(inner package)10×500g
corrugated fiber-board box(outer package)2×5000g


 
Tin Lead No Clean Solder Paste Sn63pb37Tin Lead No Clean Solder Paste Sn63pb37
Tin Lead No Clean Solder Paste Sn63pb37Tin Lead No Clean Solder Paste Sn63pb37
 
 

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