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Suzhou Lihng Electronic Technology Co., Ltd.

Solder Paste, Lead Free Solder Paste, Tin Paste manufacturer / supplier in China, offering Lead Free Silver Solder Paste Tin Paste Sn3.0AG0.5cure, SGS/Ce Snbi58 Solid Core Alloy Wire Solder Wire Welding Wire, Tool Steel & High-Speed Steel Metal Powder and so on.

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Supplier Homepage Product Low-temperature solder(One) Others Low-temperature solder(One) Lead Free Silver Solder Paste Tin Paste Sn3.0AG0.5cure

Lead Free Silver Solder Paste Tin Paste Sn3.0AG0.5cure

FOB Price: US $70-88 / Piece
Min. Order: 100 Pieces
Min. Order FOB Price
100 Pieces US $70-88/ Piece
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Port: Shanghai, China
Production Capacity: 100tons Per Month
Payment Terms: T/T

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Basic Info
  • Model NO.: Sn3.0Ag0.5CuRe
  • Flux Containing: Containing Flux
  • Trademark: LIHNG
  • Origin: China
  • Type: Solder Paste
  • Slag Characteristic: Acidic
  • Transport Package: Carton Box
Product Description
Lead Free Silver Solder Paste Tin Paste Sn3.0AG0.5cure
Product introduction
In order to meet the environmental requirements, Sn3.0Ag0.5CuRE is a no-clean lead free solder paste which is developed with unique compound active agent and advanced anti-oxidation technology accordding to the IPC and JIS standards.It has the advantages of good printability, strong anti-collapse ability, strong wetting property,  plump and bright  solder joints and less residue after welding. It is in accordance with ROHS instruction.

 Alloy compositions
Product property
ItemCharacteristicsTesting method
Flux content wt%9.0-15.0±0.5JIS Z 3197(1999)-8.1.2
Halide content in flux wt%0.04±0.02JIS Z 3197(1999)-
Viscosity  (Pa.s)180±20IPC-TM-650-2.4.34
Malcom PCU205  10rpm
Insulation resistance (Ω.cm)40ºC 90%>1×1012JIS Z 3284-3
Copper MirrorClass LIPC-TM-650-2.3.32
Corrosion of residueNo corrosionJIS Z 3284-4
Print abilityM3JIS Z3284-5
Slump in printing0.2mmJIS Z 3284-7
Slump in heating 0.2mmJIS Z 3284-8
Tackiness24hrsJIS Z 3284-9
Wetting and dewettingClass 2JIS Z 3284-10
Solder ball testClass 1~2JIS Z 3284-11
Tackiness of residueNo tackinessJIS Z 3284-12
MigrationNo occur JIS Z 3284-14
Solder powder shape and particle size  (μm)A(3#)45~25 sphericalMicroscopic measurement
B(4#)38~20  spherical
Melting point  (ºC)217~220DSC
Weight and Package
 Name Net weight
Plastic tank (inner package)500g
 Foam box   (inner package)10×500g
Carton box    (outer package)2×5000g

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