Gold Member Since 2017
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Suzhou Lihng Electronic Technology Co., Ltd.

Solder Paste, Lead Free Solder Paste, Tin Paste manufacturer / supplier in China, offering Lead Free Silver Solder Paste Tin Paste Sn3.0AG0.5cure, SGS/Ce Snbi58 Solid Core Alloy Wire Solder Wire Welding Wire, Tool Steel & High-Speed Steel Metal Powder and so on.

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Supplier Homepage Product Low-temperature solder(One) Others Low-temperature solder(One) Lead Free Silver Solder Paste Tin Paste Sn3.0AG0.5cure

Lead Free Silver Solder Paste Tin Paste Sn3.0AG0.5cure

FOB Price: US $70-88 / Piece
Min. Order: 100 Pieces
Min. Order FOB Price
100 Pieces US $70-88/ Piece
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Port: Shanghai, China
Production Capacity: 100tons Per Month
Payment Terms: T/T

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Basic Info
  • Model NO.: Sn3.0Ag0.5CuRe
  • Flux Containing: Containing Flux
  • Trademark: LIHNG
  • Origin: China
  • Type: Solder Paste
  • Slag Characteristic: Acidic
  • Transport Package: Carton Box
Product Description
Lead Free Silver Solder Paste Tin Paste Sn3.0AG0.5cure
Product introduction
In order to meet the environmental requirements, Sn3.0Ag0.5CuRE is a no-clean lead free solder paste which is developed with unique compound active agent and advanced anti-oxidation technology accordding to the IPC and JIS standards.It has the advantages of good printability, strong anti-collapse ability, strong wetting property,  plump and bright  solder joints and less residue after welding. It is in accordance with ROHS instruction.

 Alloy compositions
SnPbAgCuSbBiZnFeCdAlAsRE
Balance0.053.0±
0.2
0.5
±0.2
0.10.030.0010.020.0020.0010.030.1
 
Product property
ItemCharacteristicsTesting method
Flux content wt%9.0-15.0±0.5JIS Z 3197(1999)-8.1.2
Halide content in flux wt%0.04±0.02JIS Z 3197(1999)-8.1.4.2.1
Viscosity  (Pa.s)180±20IPC-TM-650-2.4.34
Malcom PCU205  10rpm
Insulation resistance (Ω.cm)40ºC 90%>1×1012JIS Z 3284-3
Copper MirrorClass LIPC-TM-650-2.3.32
Corrosion of residueNo corrosionJIS Z 3284-4
Print abilityM3JIS Z3284-5
Slump in printing0.2mmJIS Z 3284-7
Slump in heating 0.2mmJIS Z 3284-8
Tackiness24hrsJIS Z 3284-9
Wetting and dewettingClass 2JIS Z 3284-10
Solder ball testClass 1~2JIS Z 3284-11
Tackiness of residueNo tackinessJIS Z 3284-12
MigrationNo occur JIS Z 3284-14
Solder powder shape and particle size  (μm)A(3#)45~25 sphericalMicroscopic measurement
B(4#)38~20  spherical
Melting point  (ºC)217~220DSC
 
Weight and Package
 Package
 Name Net weight
Plastic tank (inner package)500g
 Foam box   (inner package)10×500g
Carton box    (outer package)2×5000g
 






 
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